The Biden-Harris Administration recently announced that it awarded Intel Corporation up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. The program seeks to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government.
Securing U.S. chip supply chain
The Secure Enclave program builds on previous projects between Intel and the Department of Defense (DoD). As the only American company that designs and manufactures logic chips, Intel will help secure the domestic chip supply chain. Moreover, it will collaborate with the DoD to enhance the resilience of U.S. technological systems by advancing secure, cutting-edge solutions.
The company also noted that the Secure Enclave award is separate from the proposed funding agreement that it reached with the Biden-Harris Administration in March of this year. The company’s previous agreement aimed to support the construction and modernization of semiconductor commercial fabrication facilities under the CHIPS and Science Act.
“Today’s announcement highlights our joint commitment with the U.S. government to fortify the domestic semiconductor supply chain and to ensure the United States maintains its leadership in advanced manufacturing, microelectronics systems, and process technology,” stated Chris George, president and general manager of Intel Federal.
The company also noted that Intel Foundry is nearing completion of a historic pace of design and process technology innovation with its most advanced technology – Intel 18A – on track for production in 2025.
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Intel-U.S. government ties
In 2020, Intel was awarded the second phase of the SHIP program. The program allows the U.S. government to access Intel’s advanced semiconductor packaging capabilities in Arizona and Oregon. Moreover, it leverages Intel’s substantial annual R&D and manufacturing investments.
In 2023, the company successfully delivered the first multi-chip package prototypes under the SHIP program. This milestone was a major achievement in ensuring access to cutting-edge microelectronics packaging. In addition, it paved the way for modernization for the DoD.
In 2021, the DoD awarded Intel an agreement to provide commercial foundry services for multiple phases of the RAMP-C program.
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